Reballing is the process of repairing a damaged or malfunctioning ball grid array (BGA) on a Qualcomm smartphone CPU. The BGA is a type of surface-mount technology (SMT) component that contains a large number of small solder balls on the bottom of the chip. Over time, these balls can become damaged or wear out, leading to performance issues or complete failure of the CPU.
The Process of Reballing involves removing the damaged BGA and replacing it with a new one. This can be a complex and delicate procedure, requiring specialized equipment and a skilled technician. Here are the steps involved in the process of Reballing a Qualcomm smartphone CPU:
Preparing the Work Area:
The first step is to prepare a clean and static-free work area. This will help to minimize the risk of contamination and damage to the components during the reballing process.
Removing the Old BGA:
The next step is to remove the old BGA from the CPU. This can be done using a hot air gun or a soldering iron, depending on the specific chip.
Cleaning the CPU:
Once the old BGA has been removed, the CPU should be thoroughly cleaned to remove any residue or contaminants. This can be done using a solvent or an ultrasonic cleaner.
Applying the New BGA:
The new BGA should be carefully positioned onto the CPU and secured using a specialized soldering tool. This step requires precise positioning and a steady hand to ensure that the new BGA is properly aligned and securely attached to the CPU.
Testing the CPU:
Once the reballing process is complete, the CPU should be tested to ensure that it is functioning properly. This can be done using diagnostic software or by testing the device itself.